Lead Semiconductor Manufacturing Engineer

As a Lead Semiconductor Manufacturing Engineer here at Honeywell, you will play a pivotal role in the semiconductor manufacturing team, overseeing complex projects and guiding the development of cutting-edge semiconductor technologies, focused primarily on integrating fab and assembly process technologies and techniques. Your expertise and strategic vision will be instrumental in achieving Honeywell's semiconductor technology goals.

You will report directly to our Sr Semiconductor Manufacturing Engineering Manager, and you'll work out of our Plymouth, MN location on an onsite work schedule.

In this role, you will impact the development and improvement of semiconductor manufacturing and assembly processes into new semiconductor technologies, ensuring the highest quality and efficiency. You will collaborate with cross-functional teams across various organizations to drive innovation, optimize manufacturing operations, and implement best practices. Your work will not only advance our business but also create solutions that address some of the world's most pressing challenges.

At Honeywell, our people leaders play a critical role in developing and supporting our employees to help them perform at their best and drive change across the company. Help to build a strong, diverse team by recruiting talent, identifying and developing successors, driving retention and engagement, and fostering an inclusive culture.

KEY RESPONSIBILITIES

• Develop and optimize new integrated fab and assembly processes into new product offering, and continuously improve aspects of the underlying technology integration

• Collaborate with cross-functional teams and multiple organizations within Honeywell to drive innovation and continuous improvement

• Ensure compliance with quality standards and regulatory requirements

• Translate high level integration needs to specific process needs, and communicate those needs to the specific fab or assembly process experts so they can collaborate to find the best solutions

• Troubleshoot and offer technical solutions to complex integration and manufacturing issues

• Generate detailed technical reports, documentation, and presentations for internal and external stakeholders

U.S. CITIZEN REQUIREMENTS

Must be a US Citizen due to contractual requirements.

Pay Range for Roles in Specific Location:

The annual base salary range for this position is $128,000 - $160,000. Please note that this salary information serves as a general guideline. Honeywell considers various factors when extending an offer, including but not limited to the scope and responsibilities of the position, the candidate's work experience, education and training, key skills, as well as market and business considerations.

For Salaried w/Incentive Plan (MIP, SIP, etc): This position is incentive plan eligible.

Benefits Language:

In addition to a competitive salary, leading-edge work, and developing solutions side-by-side with dedicated experts in their fields, Honeywell employees are eligible for a comprehensive benefits package. This package includes employer subsidized Medical, Dental, Vision, and Life Insurance; Short-Term and Long-Term Disability; 401(k) match, Flexible Spending Accounts, Health Savings Accounts, EAP, and Educational Assistance; Parental Leave, Paid Time Off (for vacation, personal business, sick time, and parental leave), and 12 Paid Holidays. For more information visit: Benefits at Honeywell (https://benefits.honeywell.com/)

Posting Timeline Language:

The application period for the job is estimated to be 40 days from the job posting date; however, this may be shortened or extended depending on business needs and the availability of qualified candidates.

YOU MUST HAVE

• Bachelor’s degree from an accredited institution in a technical discipline such as science, technology, engineering, mathematics • Minimum of 8 years of experience in advanced manufacturing • Proficient knowledge of semiconductor manufacturing processes and equipment (including RIE, PVD, PECVD, LPCVD, wet etching, CMP, lithography, plating, die attach, flip chip assembly, column attach and mechanical interactions) • Strong problem-solving and analytical skills • USG Secret security clearance in good standing, or US Citizenship and no known barriers to achieve a USG Secret security clearance [non-citizens are ineligible for clearance]

WE VALUE

• Master's or higher degree in Electrical Engineering, Semiconductor Engineering, Chemical Engineering, Materials Science or related field • Experience with advanced semiconductor manufacturing and assembly techniques • Knowledge of industry standards and regulations • Strong leadership, communication and team management skills • Complex project management experience • Microsoft Office suite capability

ABOUT HONEYWELL

Honeywell International Inc. (Nasdaq: HON) invents and commercializes technologies that address some of the world’s most critical challenges around energy, safety, security, air travel, productivity, and global urbanization. We are a leading software-industrial company committed to introducing state of the art technology solutions to improve efficiency, productivity, sustainability, and safety in high growth businesses in broad-based, attractive industrial end markets. Our products and solutions enable a safer, more comfortable, and more productive world, enhancing the quality of life of people around the globe.

Honeywell is an equal opportunity employer. Qualified applicants will be considered without regard to age, race, creed, color, national origin, ancestry, marital status, affectional or sexual orientation, gender identity or expression, disability, nationality, sex, religion, or veteran status.

Honeywell is an equal opportunity employer. Qualified applicants will be considered without regard to age, race, creed, color, national origin, ancestry, marital status, affectional or sexual orientation, gender identity or expression, disability, nationality, sex, religion, or veteran status.