Brainstorm, and develop new packaging concepts for next generation product platforms. Perform thermal, thermo-mechanical, and mechanical Finite Element Analysis (FEA) analyses using Ansys (preferred) as well as Failure Modes and Effects Analysis (FMEAs) on concepts. Actively engage supply base to understand their capability and roadmaps. Ability to determine intersections of vendor capability roadmaps with the company's next generation platforms. Create and maintain Application-Specific Integrated Circuit (ASIC) package interface specs. Create initial electrical test specification for ASIC package manufacturing. Support mechanical/thermal/reliability simulation and or experimentation as required. Hybrid position with work in office and at home.

Ref job code C#7384634 & email resume to: Infinera Corporation, Attn: HR, jobs-US@infinera.com. EOE. Must include ref code.