Key Responsibilities:

• Responsible for daily TEM operation, analysis data acquisition, and provide timely, high quality analysis reports.

• Develop imaging and sample preparation techniques, and best-known methods (BKM) to improve lab analysis quality, efficiency and output. Create and update procedures and documentation.

• Train and provide guideline of sample preparation techniques to FIB technicians for successful TEM analysis.

• Develop TEM imaging/data analysis techniques to enable TEM analysis to understand cross-section or top-view critical dimensions (CD), identify patterns of interest, understand image quality requirements and sample/beam interactions to determine optimized conditions, and complete requested jobs under limited supervision after training.

• Understand the basic principles of scanning electron microscopy (SEM), focused ion beam (FIB), transmission electron microscopy (TEM) and Materials analysis (EDX, EELS).

• Perform TEM system and routine maintenance procedures and calibrations.

• Perform routine troubleshoot procedures, identify problems, restart or standby the tool. Coordinate instrument repair and maintenance.

• Interface with R&D and Applications development engineers, understand their detailed requirements, define sampling plan and analysis approach, communicate results.

• Prioritize and monitor job queue and maintain lab throughput.

• Document redo and lessons learned to lower redo rate.

• Adhere to lab protocols and SOPs.

• Cooperate and coordinate the characterization effort with other AMAT labs such as materials analysis lab or SEM lab to achieve analysis goals within the same project.

• Perform basic operations of Microsoft Outlook and Office software.

• Follow safety protocols and processes.

• Work shift is 1st shift weekday, 6AM to 2PM Monday to Friday.

Qualifications

• Education:

• BS/MS degree in Material Science, Chemistry, Physics or Chemical Engineering.

• Knowledge in any semiconductor process module and characterization, semiconductor device physics, semiconductor fabrication.

• Years of Experience:

• Minimum 3 Years of hands-on TEM Work Experience. Fab-experience or Failure analysis background is a plus.

• Proven TEM experiences by recent publications

Qualifications

Education:

Bachelor's Degree

Skills:

Certifications:

Languages:

Years of Experience:

4 - 7 Years

Work Experience:

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

Yes

U.S. Salary Range:

$104,000.00 - $143,000.00

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.